Acid texturing is applied mainly with multi-crystalline wafers. With this process, not only are soiling and damage incurred during the sawing process removed, but at the same time the surface of the wafer is enlarged. The isotropic surface texture reduces the reflection of the sun's rays on the subsequent surface of the cell.

Inline system for the removal of saw damage and for enlarging the surface of the wafer.

• Gentle wafer handling without transport damage
• Transport system designed for the handling of different wafer sizes in one line
• Reduced drag-in/out of chemicals
• Shorter and more constant process guarantees a high reproduction accuracy
• Process control through automatic dosing and bath monitoring
• Continuous circulation of chemistry
• Stain-free drying with dry jets
• Lower chemistry consumption of 30% to 40% with one-sided texturing process
• Extendable process line