The alkaline texturing process is only applied on mono-crystalline wafers. This process, not only removes the soiling and damage which incurred during the sawing process, but at the same time enlarges the surface of the wafer. The pyramidal, even surface texture reduces the sun's rays on the subsequent surface of the cell.

Inline system for the removal of sawing residues and for the enlargement of the wafer surface.

• Gentle wafer handling without transport damage
• Transport system designed for the handling of different wafer sizes in one line
• Reduced drag-in/out of chemicals
• Shorter and more constant process guarantees a high reproduction accuracy
• Process control through automatic dosing and bath monitoring
• Continuous circulation of chemistry
• Stain-free drying with dry jets
• Extendable process line