In the PECVD (Plasma Enhanced Chemical Vapour Deposition) coating system the wafer is coated with an anti-reflection layer consisting of silicone nitride. This technology uses a direct plasma reactor which achieves considerably improved cell efficiency in comparison to the remote plasma reactor. The PECVD system is based on technology developed by the Japanese manufacturer Shimadzu.

PECVD System for anti-reflection coating based on silicon nitride

• Excellent surface passivation due to high process temperatures and direct plasma
• Outstanding layer uniformity
• Stable and reproducible process
• Gentle, almost contact-free wafer handling with Bernoulli grippers
• Compact system design with a small footprint
• Throughput of up to 1,147 wafers per hour