Wafer line

In the inline wafer backend process the sawn wafer blocks are first pre-cleaned with a new technique (Ceramic Beam) and deglued, then transported for singulation and cleaned again. A pick+place robot transfers the wafers to the Schmid Metrology Sorter System for classification. Here the wafers are inspected according to various criteria and sorted into polystyrene transport boxes.

 

Specifications

Fully integrated inline wafer production from pre-cleaning through singulation to classification

  • High throughput of 3,000 wafers/h with low breakage rate
  • Consistent cleaning results improve the cell efficiency
  • Gentle pre-cleaning with new Ceramic Beam cleaning process
  • Gentle wafer singulation under water using water jets
  • CCD cameras ensure high inspection accuracy in the classification process
  • Fully automatic handling