After the sawing process the wafers are cleaned very gently with the newly developed "ceramic beam" technology. The cleaning agent hereby flows into the interior channels through the kerfs, or gaps which are created in the sawing process and is distributed evenly over the whole wafer surface.

Inline system for pre-cleaning and deglueing sawn wafer blocks

• Even cleaning results over the entire surface
• The cleaning medium is supplied by the "Ceramic Beam"
• Low breakage rate during the cleaning of the wafer blocks due to revolutionary cleaning method.
• Cleaning capacity of up to 4 wafer blocks per hour
• Cleaning process for removing the residual metal ions
• Suitable for 500 mm panel (beam) and for 1000 mm panel (beam)
• Suitable for ultra thin mono and multi wafers
• Low water consumption
• Improved cost of ownership