Wafer Singulation
The multi track concept of the system which consists of two parallel loading stations and separation units each reduces set-up times and increases availability. Each line can separate up to 1600 wafers per hour (depending on the condition of the wafer stacks on delivery).
Specifications
Inline module for the separation of sawn and deglued wafers
- Stress-free removal of the wafers in the water tank
- Independent working lines
- Automatic breakage and double wafer detection
- Automatic stripping of double wafers
- Process control ensures high degree of performance safety
- Wafer infeed via SCHMID carriers



