The panel measuring table supplies fast information on the etching distribution after differential etching processes or on the thickness of copper plating. The measurements are carried out fully automatically by a sensor after entering the panel size, minimum measuring distance from panel edge, and number of measuring points in x and y direction.

Inline system for fast, precise measurement of copper-plate thickness on PCBs and for the adjustment and monitoring of etching systems

• Easy and precise adjustment of etching and plating systems
• Quick checking of existing settings
• Wrong settings are easily detected and corrected
• Reduction of error ratio by early fault detection
• Possible to reproduce parameter settings
• Easy handling
• Clearly structured evaluation
• Little space required