For inner layers, multi layers and double-sided circuits. The desmear treatment takes place in three process steps. First the drill dust is removed, then the smear in the bore holes softened and afterwards completely removed by a permanganate solution. The result is a micro fine textured resin surface.

Inline system for cleaning drilled holes and roughening the resin surfaces of PCBs

• Process modules in stainless steel execution for high process temperatures
• Fully automatic dosing based on area calculations
• Electrolytical regeneration of permanganate without additional chemicals
• Fully automatic, individual proportioning controlled by analog level transducers
• Ultrasonic transmitters support the swelling and cleaning process
• Automatic vapour trap for the prevention of bath contamination due to vapour movement