The galvanic plating system NTwC features a segmented contact frame, which permits contact of the panels only along the side edges and ensures an even copper deposition. During the plating process, the pulse form is controlled by rectifiers. The targeted flooding with fluid jets provides an optimum electrolyte exchange.

Inline system for horizontal plating of PCBs from 0.1 mm to 5 mm.

• Selective U/I regulation for homogenous distribution of the metal plating
• Extended pulse shaping, various forward and reverse currents can be defined per pulse
• Higher productivity due to insoluble, maintenance-free anodes
• Efficient flooding due to fluid jets for the wetting of blind vias and through holes on both sides
• Copper oxide dissolving station with automatic vacuum conveyor system for metal replenishment.
• Contact frame for rigid panels and inner layers, as an option also for panel thicknesses up to 5 mm