Desmear + Metallisation

Desmear and metallisation processes are applied for cleaning drilled holes and generating conductive layers in through holes, blind vias and on the dielectric.

Here you will find further information of the Desmear + Metallisation process

Desmear

Inline system for cleaning drilled holes and roughening the resin surfaces of PCBs > more

Direct Metallization

Inline system for generating conductivity in micro vias > more

Electroless Copper

Inline system for generating conductivity in through-holes and blind vias as well as on dielectrics > more

Electroplating

Inline system for horizontal plating of PCBs from 0.1 mm to 5 mm. > more

Immersion Tin

Inline system for the tin-plating of copper surfaces and bore holes after solder mask coating > more